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What Is The Ratio Of Epoxy and Hardener?
#epoxy #hardener #ratio
1. Amine curing agents
W(mass fraction of amine curing agent required for 100 mass fraction resin)/%=(amine equivalent/epoxy equivalent)*100 mass fraction resin=(molecular weight of... moreWhat Is The Ratio Of Epoxy and Hardener?
#epoxy #hardener #ratio
1. Amine curing agents
W(mass fraction of amine curing agent required for 100 mass fraction resin)/%=(amine equivalent/epoxy equivalent)*100 mass fraction resin=(molecular weight of amine*100 mass fraction resin)/ (number of active hydrogen atoms in amine molecule*epoxy equivalent=(molecular weight of amine/number of active hydrogen atoms in amine molecule)*epoxy value=(molecular weight of amine/number of active hydrogen atoms in amine molecule)*(percentage of epoxy matrix/epoxy group molecular mass)
2. Calculating the dosage of low relative molecular weight Polyamide
Amine value is often used to measure the number of amino groups in the specification of polyamide products in low relative molecule, which can not correctly reflect the number of active hydrogen atoms. Therefore, the amine value can not be simply used as the basis for calculating the amount of polyamide. For typical polyamides, the following formula can be used to calculate the dosage.
W(polyamide)%=(56100/amine value*f)*epoxy value n-3
3. Calculating the dosage of ketoimide
W(ketoimide)%=(curing agent equivalent/epoxy equivalent)*100
"Equivalent" here means that ketimine reacts with water at the same time.
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What Is Epoxy Hardener Made Of
#what #is #epoxy #resin #hardener
The epoxy resin itself is a thermoplastic linear structure. After heating, the solid resin can be softened and melted into a viscous or liquid state. The thermal viscosity of liquid resin... moreWhat Is Epoxy Hardener Made Of
#what #is #epoxy #resin #hardener
The epoxy resin itself is a thermoplastic linear structure. After heating, the solid resin can be softened and melted into a viscous or liquid state. The thermal viscosity of liquid resin decreases. Only when curing agent is added, epoxy resin can be used practically.
Composition of epoxy resin
A. Resin Composition
(1) Epoxy resin: Main component of resin composition, Bisphenol A epoxy resin and other types of epoxy resin
(2) Curing agent: reacting with epoxy resin to form three-dimensional network polymer compounds
B. Modified components
(1) Plasticizers: Plasticizers give flexibility, but reduce heat resistance and drug resistance.
(2) Toughening agent: improve impact resistance, and make other properties reduced little, such as liquid acid carboxylated rubber
(3) Filler: increase weight, improve solidification, mechanical, thermal and electrical properties, such as calcium carbonate, mica, etc.
C. Regulating fluidity components (1) Dilutants: reducing the viscosity of components, which are divided into active diluents and inactive diluents. Thixotropic agent: give thixotropy to components, such as asbestos, silicon powder, etc.
D. Other ingredients: pigments, solvents, defoamers, levelers, tackifiers, etc.
After learning what is epoxy resin hardener, you may want to know what they are used for. Epoxy resins can be widely used because of the combination of these components. Especially curing agent, once the epoxy resin is determined, curing agent plays a decisive role in the technological properties of epoxy resin components and the final properties of curing agent products (products). Epoxy resin itself is a linear structure of thermoplasticity. It can not be used directly. A second component must be added to the resin. Under certain temperature (or humidity) and other conditions, epoxy group of epoxy resin is used for addition polymerization or catalytic polymerization to produce cured materials with three-dimensional network structure (bulk network structure). This compound or resin, which acts as the second component, is called curing agent and is divided into additive curing agent and catalytic curing agent.
Curing agent:
A. Normal temperature curing
Heavy-duty anticorrosive coatings; Civil building adhesives; Civil building coatings; FRP; General binders.
Straight chain aliphatic polyamines, polyamides, alicyclic polyamines, denatured polyamines, polymercaptan
B. Heating curing
(1) Electrical insulating materials: acid anhydride, imidazole compounds, BF3 complex.
(2) Laminating materials: Dicy, aromatic polyamines, linear phenolic resin.
(3) Coatings (Tank: Amino Resin, Phenolic Resin, Powder: Dicy, Aromatic Polyamines, Anhydride).
(4) Molding material: linear phenolic resin.
(5) Binders: Aromatic polyamines, anhydrides, imidazoles, BF3-complexes.
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